• First Temasek Bond with retail tranche
• Placement of S$200 million to specified investors
• Public Offer of up to S$200 million to retail investors in Singapore
  
  
  • Applications via participating ATMs, online and mobile app
  • Offer opens Wednesday 17 October 2018 at 9:00am
  • Offer closes Tuesday 23 October 2018 at 12 noon
  • Applications in multiples of S$1,000 with minimum of S$1,000
  • CPF members may use their CPF Savings
• Approval in-principle for listing on the SGX-ST
   

Singapore, 16 October 2018, 6.20pm – Temasek Holdings (Private) Limited (“Temasek”) is offering its first Temasek Bond with a Public Offer to retail investors in Singapore, through its wholly-owned subsidiary, Temasek Financial (IV) Private Limited (the “Issuer”).

The T2023-S$ Temasek Bond comprises 2.70% fixed rate guaranteed notes due 2023, offered under the Issuer’s S$5 billion Guaranteed Medium Term Note Programme (the “Programme”), and will be unconditionally and irrevocably guaranteed by Temasek.

The proposed Total Offering of up to S$400 million of the T2023-S$ Temasek Bond comprises:

(a) a Placement of S$200 million of bonds to institutional, accredited and other specified investors; and
(b) a Public Offer of up to S$200 million of bonds to retail investors in Singapore.

The proposed Total Offering is also subject to an Upsize Option, the Allocation Condition and the Re-allocation. More details follow later in this announcement.

Ms Leong Wai Leng, Temasek’s Chief Financial Officer, said:
“Temasek has been issuing bonds to institutional, accredited and other specified investors since 2005. We are pleased to offer Temasek Bonds to retail investors for the first time. This helps Temasek to broaden its stakeholder base and provide Singapore retail investors the opportunity to participate in another retail product.

“The interest rate offered to the retail investors under the Public Offer is the same as that for the Placement. We have determined the interest rate through a book building with institutional, accredited and other specified investors. This price discovery process is the same as that for all our previous bond issuances.

“We issue Temasek Bonds as public markers of our credit quality – this is very much as part of our financial discipline as a long term investor. They also increase our funding flexibility,” Ms Leong added.

Use of Proceeds

The net proceeds from the Total Offering will be provided by the Issuer to Temasek and its investment holding companies to fund their ordinary course of business.

Principal Terms of T2023-S$ Temasek Bond

The T2023-S$ Temasek Bond pays a fixed Interest Rate of 2.70% per annum, payable at the end of every six month period, and has a tenor of five years from the expected Issue Date of Thursday 25 October 2018. The bonds will be cleared through CDP.

The T2023-S$ Temasek Bond will be issued in denominations of S$1,000. The issue price of the T2023-S$ Temasek Bond is S$1,000.

Full details of the terms and conditions of the Total Offering and the T2023-S$ Temasek Bond are set out in the Offering Circular for the Programme dated 3 August 2018 and the Pricing Supplement in relation to the bonds dated 16 October 2018 announced on SGXNET on Tuesday 16 October 2018.

Use of CPF and SRS Funds

The T2023-S$ Temasek Bond is eligible for inclusion under the CPF Investment Scheme - Ordinary Account.

Interested members of the CPF in Singapore CAN use up to 35% of their investible CPF Savings to apply for the bonds under the Public Offer, or to purchase the bonds subsequently from the market.

CPF Savings CANNOT be used to apply for bonds under the Placement.

SRS funds CANNOT be used to apply for the T-2023-S$ Temasek Bond in the Total Offering.

Investors with SRS accounts should consult their stockbrokers and the relevant banks in which they hold their SRS accounts if they wish to purchase the bonds from the market using SRS funds, after the completion of the Total Offering and the listing of such bonds on the SGX-ST.

Application and Payment Procedures for Retail Investors in Public Offer

An application under the Public Offer must be in multiples of S$1,000, subject to a minimum subscription of S$1,000.

Applications under the Public Offer are payable in full immediately, and must be made through:

• ATMs of DBS Bank, POSB, OCBC Bank or UOB;
• Internet banking websites of
  
  
  • DBS Bank at <https://www.dbs.com>,
  • POSB Bank at <https://www.posb.com.sg>,
  • OCBC Bank at <https://www.ocbc.com>, or
  • UOB at <https://www.uobgroup.com>; or
• Mobile banking apps of DBS Bank or POSB.
  

Retail investors in Singapore will need a CDP account to apply for this bond.

Subscriptions under the Public Offer will be subject to balloting and allocation if the total subscriptions exceed the amount available for subscription under the Public Offer.

If an applicant under the Public Offer is unsuccessful, in whole or part, for whatever reason, the unsuccessful proportion of the application amount will be refunded without interest.

More details can be found in "Terms, Conditions and Procedures for Application and Acceptance" in Appendix C of the Pricing Supplement.

Application and Payment Procedures for Institutional, Accredited and Other Specified Investors in Placement

An application under the Placement must be in multiples of S$250,000 subject to a minimum subscription of S$250,000.

Applications under the Placement are payable in full on or about the Issue Date, unless otherwise agreed by the Issuer, Temasek and the Joint Lead Managers and Bookrunners. Applications must be made directly through the Joint Lead Managers and Bookrunners, who will determine, at their discretion, the manner and method for applications.

Right to reject or accept any application under the Public Offer or Placement

The Issuer, Temasek and the Joint Lead Managers and Bookrunners reserve the right to reject or accept any application in whole or in part, or to scale down, ballot or allocate any application, without assigning any reason. This right applies to all applications for the bonds.

Important Documents to read before Application to Invest

Anyone wishing to subscribe to the Public Offer or the Placement should read the Offering Circular and the Pricing Supplement in full. Applications must be made in the manner set out in the Pricing Supplement.

Retail investors should also read the Product Highlights Sheet in relation to the T-2023-S$ Temasek Bond dated 16 October 2018.

Electronic copies of Offering Circular, the Pricing Supplement and the Product Highlights Sheet are available on Temasek’s website at www.temasek.com.sg/bondoffer and the "Company Announcements" section under the "Company Information" tab of the SGX-ST website at http://www.sgx.com.

Print copies of the Offering Circular, the Pricing Supplement and the Product Highlights Sheet may also be obtained on request, subject to availability, during operating hours from selected branches of DBS, POSB, OCBC and UOB.

Upsize Option

An Upsize Option, to increase the Total Offering up to no more than S$500 million, may be exercised by the Issuer and Temasek, in the event the Public Offer and/or Placement is oversubscribed. The final allocation between the Public Offer and Placement (including any Re-allocation) will be determined by the Issuer and Temasek, subject to compliance with the Allocation Condition.

Allocation Condition and Re-allocation

The Total Offering is subject to the Upsize Option, and the following:

(i) Allocation Condition

The Issuer shall not be under any obligation to issue any T2023-S$ Temasek Bond unless at least 20% of the bonds are issued to institutional investors and relevant persons. This 20% minimum allocation condition is required by law and must exclude any amount of bonds issued or to be issued to the Joint Lead Managers and Bookrunners for their own accounts; and

(ii) Re-allocation

The Issuer and Temasek, at their discretion, may re-allocate the principal amount of the T2023-S$ Temasek Bond between the Public Offer and the Placement.

Credit Ratings

Temasek has been assigned an overall corporate credit rating of "Aaa" by Moody’s and "AAA" by S&P. The bonds have been rated "Aaa" by Moody’s and "AAA" by S&P. A credit rating is not a recommendation to buy, sell or hold the bonds. The credit ratings are not intended for use by retail investors, and retail investors should not consider the credit ratings in making any investment decision. All investors should contact their professional advisors before making any decisions based on the credit ratings.

Global Coordinator, Joint Lead Managers and Bookrunners

The Global Coordinator is DBS Bank Ltd., and the Joint Lead Managers and Bookrunners for the Total Offering are DBS Bank Ltd., Oversea-Chinese Banking Corporation Limited, United Overseas Bank Limited, The Hongkong and Shanghai Banking Corporation Limited, Singapore Branch and Standard Chartered Bank.

Where appropriate, the Issuer and Temasek may consult the Joint Lead Managers and Bookrunners with regard to amending the timetable, to accept or reject any application, or to exercise the Upsize Option and/or the Re-allocation.

Expected Timetable of Key Events

The Issuer expects the initial allocation of bonds under the Placement to institutional, accredited and other specified investors to be made on or shortly after Tuesday 16 October 2018. Subsequent to the initial allocation of the bonds, the Issuer may (but is not under any obligation to) allocate bonds under the Placement from time to time prior to the close of the offering period of the Placement.

The Public Offer for retail investors is expected to open at 9:00am on Wednesday 17 October 2018, and to close at 12 noon on Tuesday 23 October 2018.

Prospective investors are requested to note the important dates and times in the Expected Timetable below, in respect of the key events in the Total Offering:

The Expected Timetable is indicative only and is subject to change. All dates and times referred to above are Singapore dates and times. 7

The Issuer and Temasek may, with the approval of the SGX-ST (if required), extend, shorten or modify the Expected Timetable, subject to any limitation under any applicable laws. In particular, the Issuer and Temasek will have the absolute discretion to close the Public Offer and/or the Placement early. Any changes to the Expected Timetable will be publicly announced through a SGXNET announcement to be posted on the SGX-ST’s website at http://www.sgx.com.

Approval In-principle for Listing on the SGX-ST

On 28 September 2018, the SGX-ST granted its approval in-principle for the listing and quotation of the T2023-S$ Temasek Bond on the Main Board of the SGX-ST, subject to certain conditions. Such approval should not be taken as an indication of the merits of the Issuer, Temasek, their respective subsidiaries (if any), their respective associates (if any), the Programme or the bonds. The T2023-S$ Temasek Bond is expected to be listed on the Main Board of the SGX-ST on Friday 26 October 2018. For the purposes of trading on the Main Board of the SGX-ST, each board lot of the T2023-S$ Temasek Bond will comprise S$1,000 in principal amount of the bonds.

The listing approval is subject to the submission by the Issuer to the SGX-ST of:

(i) a written undertaking that the appointed Trustee complies with the requirements in Rule 308(3) of the Listing Manual;

(ii) a written undertaking that the Issuer has no interest in or relation to the Trustee which may conflict with the Trustee’s role as trustee;

(iii) a written undertaking that the trust deed governing the issue of the bonds complies with the requirements in Rule 308(5) of the Listing Manual;

(iv) a written undertaking that the amount of bonds issued to specified investors (excluding any amount of the bonds issued to the lead manager, arranger and underwriter for their own accounts) is not less than 20% of the size of the bonds issued;

(v) a written undertaking that the exemption criteria in the Securities and Futures (Offers of Investments) (Exemption for Offers of Straight Debentures) Regulations 2016 for the issuance of the bonds have been complied with;

(vi) a copy of the document, such as a deed poll, that may be applicable to the issue of debt securities, as required under Rule 314 of the Listing Manual;

(vii) a copy of the other documents required under Rule 315 of the Listing Manual such as the signed subscription agreement, agent bank agreement, fiscal and agency agreement; and

(viii) a duly signed undertaking in the format set out in Appendix 2.3.1 of the Listing Manual.

For further Information on the Public Offer

If you have questions on the Public Offer, please contact any of the following banks at the numbers set out below, which are available 24 hours a day, seven days a week until the close of the Public Offer.

DBS          :  1800 111 1111
POSB       :  1800 339 6666
OCBC       :  1800 363 3333
UOB         :  1800 222 2121
 

Not for distribution in the United States, or to U.S. persons
This announcement is not an offer of securities for sale in the United States. Securities may not be offered or sold in the United States absent registration or an exemption from registration under the U.S. Securities Act of 1933, as amended. No portion of the proposed offering is intended to be registered in the United States, and no offering is intended to be conducted in the United States. The T2023-S$ Temasek Bond may not be offered or sold within the United States or to, or for the account or benefit of, U.S. persons.

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Contact Us

For general enquiries, please contact us at bond@temasek.com.sg

Annex: Glossary of Terms